Features: • Diffused Junction• Low Forward Voltage Drop• High Current Capability• High Reliability• High Surge Current Capability• Ideal for Printed Circuit Boards• Pb free product are available : 99% Sn above can meet RoHS environment substance directive ...
GPJ25A: Features: • Diffused Junction• Low Forward Voltage Drop• High Current Capability• High Reliability• High Surge Current Capability• Ideal for Printed Circuit Board...
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CHARACTERISTICS |
SYMBOL |
GPJ25A |
GPJ25B |
GPJ25D |
GPJ25G |
GPJ25J |
GPJ25K |
GPJ25M |
UNIT |
Maximum Recurrent Peak Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
Maximum DC Blocking Voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
Average Recti fi ed Output Current at TC=100 |
I(AV) |
25 |
A | ||||||
I2 t Rati ng for fusi ng ( t<8.3ms) |
I2 t |
500 |
A2 sec | ||||||
Peak Forward Surge Current si ngle si ne-wave superimposed on rated load (JEDEC method) |
IFSM |
350 |
A | ||||||
Maximum Instantaneous Forward Voltage Drop per element at 12.5A |
VF |
1.1 |
V | ||||||
Maximum Reverse Leakage Current at Rated @ TA=25 Dc Blocki ng Voltage @ TC=100 |
IR |
10 500 |
uA | ||||||
yTpi cal Thermal Resi stance per leg (Note 1) |
RJC |
0.6 |
/W | ||||||
Operati ng Juncti on and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |
NOTES:
1. Device mounted on 220 x 220 x 1.6mm thick AL plate heatsink.