Features: PROPRIETARY SOFT GLASS®JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD...
GP1120: Features: PROPRIETARY SOFT GLASS®JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids:...
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PARAMETER (TEST CONDITIONS) | SYMBOL |
RATINGS |
UNITS | |||||||
Parameter | GP1150 | GP1180 | GP1200 | GP1250 |
GP1300 |
GP1400 |
GP1500 | GP1600 | ||
Maximum DC Blocking Voltage |
VRM |
1500 |
1800 |
2000 |
2500 |
3000 |
4000 |
5000 |
6000 |
VOLTS |
Maximum RMS voltage |
VRMS |
1050 |
1260 |
1400 |
1750 |
2100 |
2800 |
3500 |
4200 | |
Maximum Peak Reverse Voltage |
VRRM |
1500 |
18000 |
2000 |
2500 |
3000 |
4000 |
5000 |
6000 | |
Average Forward Rectified Current @TA =50 Lead Iength=0.375in(9.5mm) |
IO |
1000 |
500 | 200 |
AMPS
| |||||
Peak forward surge current (8.3ms single half sinewave superimposed on rated load) |
IFSM |
35 |
25 | 15 | ||||||
Maximum forward Voltage at 2A mps DC |
VFM |
1.5 |
3.0 | 4.5 |
VOLTS | |||||
Maximum DC reverse current @TJ =25 at rated DC blocking voltage @T =125 |
IRM |
1.0 |
uA | |||||||
Typical junction capacitance (Note 1) |
CJ |
12 |
pF | |||||||
Operating and Storage Temperature Range |
Tj,TSTG |
-65 to +150 |
|