SpecificationsDescriptionThe GMZ4S is designed as one kind of surface mount zener diode device, GMZ4S has three points of features:(1)Planar Die construction; (2)500mW Power Dissipation; (3)Ideally Suited for Automated Assembly Processes. And the mechanical data of this device are:(1)Case: Molded ...
GMZ4S: SpecificationsDescriptionThe GMZ4S is designed as one kind of surface mount zener diode device, GMZ4S has three points of features:(1)Planar Die construction; (2)500mW Power Dissipation; (3)Ideally ...
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The GMZ4S is designed as one kind of surface mount zener diode device, GMZ4S has three points of features:(1)Planar Die construction; (2)500mW Power Dissipation; (3)Ideally Suited for Automated Assembly Processes. And the mechanical data of this device are:(1)Case: Molded Glass MICRO-MEIF; (2)Terminals: Solderable per MIL-STD-202E, Method 208; (3)Polarity: See Diagram Below; (4)Approx. Weight: 0.01 grams; (5)Mounting Position: Any; (6)Packing information.
The absolute maximum ratings of the GMZ4S can be summarized as:(1)Power Dissipation at Tamb = 25 : 500 mW;(2)Junction Temperature: 175 ;(3)Storage Temperature Range: -65 to +175 ;(4)Thermal Resistance Junction to Ambient Air: 0.3 K/mW;(5)Forward Voltage at IF = 100mA: 1 V. If you want to know more information about the GMZ4S, please download the datasheet in www.seekic.com or www.chinaicmart.com .