Features: Optimized for CDMA2000-1X and UMTS Up to 12 UMTS or 24 CDMA2000 Downconverter and Upconverter Channels Mixed CDMA2000-1X and UMTS Operation DDC Input and DUC Output Rates to 125 MSPS Any DDC Can Connect to Any of Four Input Ports Any DUC Can Sum into Any of Four Output PortsReal/...
GC5316: Features: Optimized for CDMA2000-1X and UMTS Up to 12 UMTS or 24 CDMA2000 Downconverter and Upconverter Channels Mixed CDMA2000-1X and UMTS Operation DDC Input and DUC Output Rates to 125 MSPS ...
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Optimized for CDMA2000-1X and UMTS
Up to 12 UMTS or 24 CDMA2000 Downconverter and Upconverter Channels
Mixed CDMA2000-1X and UMTS Operation
DDC Input and DUC Output Rates to 125 MSPS
Any DDC Can Connect to Any of Four Input Ports
Any DUC Can Sum into Any of Four Output Ports
Real/Complex DDC Inputs and DUC Outputs
Programmable AGC on DDC Outputs
Rx Filtering: 6 Stage CIC, 48 Tap CFIR, 64 Tap PFIR
Tx Filtering: 6 Stage CIC, 47 Tap CFIR, 63 Tap PFIR
115-dB SFDR
16-Bit DDC Inputs, 18-Bit DUC Outputs
1.5-V Core, 3.3-V I/O
PARAMETER | SYMBOL | MIN | MAX | UNITS |
Pad ring supply voltage | VPAD |
-0.3 | 4 | V |
Core supply voltage | VCORE |
-0.3 | 1.8 | V |
Input voltage (undershoot and overshoot) | VIN |
-0.5 | V PAD+0.5 |
V |
Clamp current for an input or output | -20 | 20 | mA | |
Storage temperature | Tstg |
-65 | 140 | °C |
Junction temperature | TJ |
105 | °C | |
Lead soldering temperature (10 seconds) | 300 | °C | ||
ESD classification | Class 2 (Passed 2.5-kV HBM, 500-V CDM, 150-V MM) | |||
Moisture sensitivity | Class 4 (4 days floor life at 30°C/60%H) | |||
Reflow conditions | JEDEC standard, 240°C max |