Features: * Internal Constructure with GPRC (Glass Passivated Rectifier Chip) inside* High Case Dielectric Strength of 1500VRMS* Low Reverse Leakage Current* High Surge Current Capability* Ideal for Printed Circuit Board Applications* Plastic Material-UL Recognition Flammability Classification 94V...
GBJ25D: Features: * Internal Constructure with GPRC (Glass Passivated Rectifier Chip) inside* High Case Dielectric Strength of 1500VRMS* Low Reverse Leakage Current* High Surge Current Capability* Ideal for...
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Ratings at 25 oC ambient temperature unless otherwise specified. |
SYMBOLS |
GBJ25A |
GBJ25B |
GBJ25D |
GBJ25G |
GBJ25J |
GBJ25K |
GBJ25M |
UNITS |
Maximum repetitive peak reverse voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
Volts |
Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
Volts |
Maximum DC blocking voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
Volts |
Maximum average forward (with heatsink Note 2) rectified current at TC=100oC |
I (AV) |
25 |
Amps | ||||||
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) |
IFSM |
350 |
Amps | ||||||
Maximum instantaneous forward voltage @ IF=12.5 A |
VF |
1.05 |
Volts | ||||||
Maximum DC reverse current@TC=25oC at rated DC blocking voltage@TC=125oC |
IR |
10 500 |
uA | ||||||
I2t rating for fusing ( t < 8.3ms ) |
CJ |
510 |
pF | ||||||
Typical junction capacitance per element (NOTE 1) |
R JC |
85 |
A2s | ||||||
Typical thermal resistance (NOTE 2) |
TJ,TSTG |
0.6 |
K / W | ||||||
Operating junction and storage temperature range |
I2t |
-55 to +175 |
oC |