Features: •Ultra-thin,thickness (5×3.2×1.2mm).•It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.•Reflow soldering is possible.•CMOS, TTL IC direct drive is possible. Depending upon the frequency band...
FXO-61F: Features: •Ultra-thin,thickness (5×3.2×1.2mm).•It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.•Reflow s...
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•Ultra-thin,thickness (5×3.2×1.2mm).
•It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.
•Reflow soldering is possible.
•CMOS, TTL IC direct drive is possible. Depending upon the frequency band, there is also a crystal oscillator with a CMOS-IC with a tri-state function built in.
•Use in the broad frequency band from 1.8MHz to 50MHz is possible.