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FW241

Features: • This composite device allows high density mounting by incorporating two MOSFET chips in one package that feature low on-resistance, ultrahigh switching speed, and drive voltage of 4.5V.• The two chips have near characteristics, and especially suited for HDD.Pinout Specifica...

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SeekIC No. : 004345585 Detail

FW241: Features: • This composite device allows high density mounting by incorporating two MOSFET chips in one package that feature low on-resistance, ultrahigh switching speed, and drive voltage of ...

FW241 Data Sheet

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Part Number:
FW241
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• This composite device allows high density mounting by incorporating two MOSFET chips in one package that feature low on-resistance, ultrahigh switching speed, and drive voltage of 4.5V.
• The two chips have near characteristics, and especially suited for HDD.






Pinout






Specifications

Parameter Symbol Conditions Ratings Unit
Drain-to-Source Voltage VDSS 30 V
Gate-to-Source Voltage VGSS ±20 V
Drain Current (DC) ID 3.5 A
Drain Current (Pulse) IDP PW10s, duty cycle1% 14 A
Allowable Power Dissipation PD Mounted on a ceramic board (2000mm2*0.8mm)1unit 1.4 W
Tc=25°C 2.0 W
Channel Temperature Tch 150 °C
Storage Temperature Tstg -55 to +150 °C


Absolute maximum ratings
VDSS [V] 30
VGSS [V] 20
ID [A] 3.5
PD [W] 2
Tc=25°C
Electrical characteristics
RDS(on) typ []
VGS=10V
ID [A]=3.5		 0.064
RDS(on) typ []
VGS=4.5V
ID [A]=1.8		 0.105
VGS(off) min [V] 1.2
VGS(off) max [V] 2.5
|yfs| typ [S] 5.3
Ciss typ [pF] 180
Qg typ [nC] 5
f [kHz] 200





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