Specifications SYMBOL PARAMETER CONDITIONS Min. Max. Unit I T(RMS) On-state Current All Conduction Angle, TL = 60 ºC 1.25 A I T(AV) Average On-state Current Half Cycle, Q = 180 º, TL = 60 ºC 0.8 A ITSM Non-repetitive On-State...
FS02...A: Specifications SYMBOL PARAMETER CONDITIONS Min. Max. Unit I T(RMS) On-state Current All Conduction Angle, TL = 60 ºC 1.25 A I T(AV) Average On-state Cur...
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SYMBOL |
PARAMETER | CONDITIONS |
Min. |
Max. |
Unit |
I T(RMS) |
On-state Current | All Conduction Angle, TL = 60 ºC |
1.25 |
A | |
I T(AV) |
Average On-state Current | Half Cycle, Q = 180 º, TL = 60 ºC |
0.8 |
A | |
ITSM |
Non-repetitive On-State Current | Half Cycle, 60 Hz, Tj = 25 ºC |
25 |
A | |
ITSM |
Non-repetitive On-State Current | Half Cycle, 50 Hz, Tj = 25º C |
22.5 |
A | |
I2t |
Fusing Current | tp = 10ms, Half Cycle |
2.5 |
A2s | |
VGRM |
Peak Reverse Gate Voltage | IGR = 10 A, Tj = 25 ºC |
8 |
V | |
IGM |
Peak Gate Current | 20 s max. |
1.2 |
A | |
PGM |
Peak Gate Dissipation | 20 s max. |
3 |
W | |
P G(AV) |
Gate Dissipation | 20ms max. |
0.2 |
W | |
Tj |
Operating Temperature |
-40 |
+125 |
||
Tstg |
Storage Temperature |
-40 |
+150 |
||
Tsld |
Soldering Temperature |
260 |