Features: Plastic package has Underwriters Laboratory Flammability Classification 94V-0Glass passivated chip junctionLow power lossLow forward voltage, high current capabilityHigh surge current capabilitySuperfast recovery time, for high efficiencyHigh temperature soldering in accordance with CECC...
FESB16DT: Features: Plastic package has Underwriters Laboratory Flammability Classification 94V-0Glass passivated chip junctionLow power lossLow forward voltage, high current capabilityHigh surge current capa...
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SYMBOLS |
FESB |
FESB |
FESB |
FESB |
FESB |
FESB |
FESB |
FESB |
UNITS | |
Maximum repetitive peak reverse voltage |
VRRM |
50 |
100 |
150 |
200 |
300 |
400 |
500 |
600 |
Volts |
Maximum RMS voltage |
VRMS |
35 |
70 |
105 |
140 |
210 |
280 |
350 |
420 |
Volts |
Maximum DC blocking voltage |
VDC |
50 |
100 |
150 |
200 |
300 |
400 |
500 |
600 |
Volts |
Maximum average forward rectified current |
I(AV) |
16.0 |
Amps | |||||||
Peak forward surge current |
IFSM |
250.0 |
Amps | |||||||
Maximum instantaneous forward voltage at 16A |
VF |
0.975 |
1.3 |
1.5 |
Volts | |||||
Maximum DC reverse current TC=25°C |
IR |
10.0 |
A | |||||||
Maximum reverse recovery time (NOTE1) |
trr |
35.0 |
50.0 |
ns | ||||||
Typical junction capacitance(NOTE 2) |
CJ |
175.0 |
145.0 |
pF | ||||||
Typical thermal resistance (NOTE 3) |
RJA |
1.2 |
°C/W | |||||||
Operating and storage temperature range |
TJ, TSTG |
-65 to +150 |
°C |