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FC7113

Features: Small surface mounting package (3x3x1.32mm) Operating frequency: 824~849MHz CDMA single-mode operation up to 28dBm AMPS single-mode operation up to 31dBm High efficiency: 55% AMPS, 39.5% CDMA Very low quiescent current: 34mA Low leakage current in shutdown mode: < 1uA Optimized for a ...

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SeekIC No. : 004340810 Detail

FC7113: Features: Small surface mounting package (3x3x1.32mm) Operating frequency: 824~849MHz CDMA single-mode operation up to 28dBm AMPS single-mode operation up to 31dBm High efficiency: 55% AMPS, 39.5% C...

FC7113 Data Sheet

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Part Number:
FC7113
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/18

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Product Details

Description



Features:

Small surface mounting package (3x3x1.32mm)
Operating frequency: 824~849MHz
CDMA single-mode operation up to 28dBm  
AMPS single-mode operation up to 31dBm
High efficiency: 55% AMPS, 39.5% CDMA
Very low quiescent current: 34mA
Low leakage current in shutdown mode: < 1uA
Optimized for a 50 W system
Lead-free package
No passive component in package


Application

Single mode CDMA wireless handsets
Dual mode AMPS/CDMA wireless handsets


Specifications

Parameter
Unit
Min
Max
Supply Voltage (Vcc)
V
-
+5
Mode Control Voltage (VMODE)
V
-
+3.2
Reference Voltage (VREF)
V
-
+3.2
RF Input Power (RF IN)
dBm
-
+7
Storage Temperature (Tstg)
C
-55
+125



Description

    FC7113 is a high-power, high-efficiency power amplifier module for CDMA/AMPS wireless  handsets. It consists of a two-stage amplifier, 50- ohm matching network for both input and output  ports, and bias control circuitry. One of the most important  features of  FC7113, the  fixed bias mode operation,  which  eliminates the need for mode change  between low-power  and  highpower/high-gain mode,  provides excellent performance up to 31-dBm output power. This advantage  also  makes it possible to carry out one step calibration  in  any  handsets with  very low idle current. It is assembled in a 3-mm x 3-mm package without any passive component in it. This lead-free package  provides excellent electrical stability and low thermal resistance. This FC7113 is manufactured  with an advanced InGaP HBT MMIC process.




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