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F50N06LE

Features: * 50A, 60V*rDS(ON) = 0.022* Temperature Compensating PSPICE® Model* Peak Current vs Pulse Width Curve* UIS Rating Curve* 175 Operating Temperature* Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards PinoutSpecificationsDrain to Source Voltage (N...

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SeekIC No. : 004340079 Detail

F50N06LE: Features: * 50A, 60V*rDS(ON) = 0.022* Temperature Compensating PSPICE® Model* Peak Current vs Pulse Width Curve* UIS Rating Curve* 175 Operating Temperature* Related Literature- TB334 Guideline...

F50N06LE Data Sheet

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Part Number:
F50N06LE
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/18

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Product Details

Description



Features:

* 50A, 60V
*rDS(ON) = 0.022
* Temperature Compensating PSPICE®  Model
* Peak Current vs Pulse Width Curve
* UIS Rating Curve
* 175  Operating Temperature
* Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Pinout

Connection Diagram


Specifications

Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . .VDSS
Drain to Gate Voltage (RGS = 20k )  (Note 1) . . . . . . . . . . . . . . . .. . . . . . . . V DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .VGS
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS
Power Dissipation  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD
Derate Above 25  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . T J , TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg


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