Features: Glass passivated chipHigh case dielectric strengthHigh surge current capabilityHigh reliabilityLow reverse currentLow forward voltage dropFast switching for high efficiencyIdeal for printed circuit boardPinoutSpecifications RATING SYMBOL F2W 005G F2W 01G F2W 02G ...
F2W005G: Features: Glass passivated chipHigh case dielectric strengthHigh surge current capabilityHigh reliabilityLow reverse currentLow forward voltage dropFast switching for high efficiencyIdeal for print...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
RATING |
SYMBOL |
F2W |
F2W |
F2W |
F2W |
F2W |
F2W |
F2W |
UNIT |
Maximum Recurrent Peak Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
Volts |
Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
Volts |
Maximum DC Blocking Voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
Volts |
Maximum Average Forward Current |
IF(AV) |
2.0 |
Amps. | ||||||
Peak Forward Surge Current Single half sine wave |
IFSM |
30 |
Amps. | ||||||
Rating for fusing ( t < 8.3 ms. ) |
I2 t |
10 |
A2S | ||||||
Maximum Forward Voltage per Diode at IF = 1.0 Amp. |
VF |
1.3 |
Volts | ||||||
Maximum DC Reverse Current Ta = 25 C |
IR |
10 |
mA | ||||||
IR(H) |
1.0 |
mA | |||||||
Maximum Reverse Recovery Time (Note 1) |
Trr |
150 |
250 |
500 |
ns | ||||
Typical Junction Capacitance per Diode (Note 2) |
CJ |
24 |
pf | ||||||
Typical Thermal Resistance (Note 3) |
RqJA |
36 |
°C/W | ||||||
|
TJ |
- 50 to + 150 |
°C | ||||||
Storage Temperature Range |
TSTG |
- 50 to + 150 |
°C |