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ESD9L

Features: `Ultra Low Capacitance 0.5 pF`Low Clamping Voltage`Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm)`Low Body Height: 0.016 (0.4 mm)`Stand-off Voltage: 5 V`Low Leakage`Response Time is Typically < 1.0 ns`IEC61000-4-2 Level 4 ESD Protection`This is a Pb-Free DeviceSpecif...

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SeekIC No. : 004338274 Detail

ESD9L: Features: `Ultra Low Capacitance 0.5 pF`Low Clamping Voltage`Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm)`Low Body Height: 0.016 (0.4 mm)`Stand-off Voltage: 5 V`Low Leakage`Respo...

ESD9L Data Sheet

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Part Number:
ESD9L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

`Ultra Low Capacitance 0.5 pF
`Low Clamping Voltage
`Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm)
`Low Body Height: 0.016 (0.4 mm)
`Stand-off Voltage: 5 V
`Low Leakage
`Response Time is Typically < 1.0 ns
`IEC61000-4-2 Level 4 ESD Protection
`This is a Pb-Free Device


Specifications

Rating
Symbol
Value
Unit

IEC 61000-4-2 (ESD) Contact
Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature - Maximum (10 Second Duration)

PD
T stg
T J
T L
±10
150
-55 to +150
-55 to +125
260
kV
mW
°C
°C
°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in.




Description

The ESD9L is designed to protect voltage sensitive components that require ultra-low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications.




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