Features: * Very low profile - typical height of 1.0mm* For surface mount application* Glass passivated chip junction* Ultrafast recovery times for high efficiency* Low forward voltage, low power loss* Built in strain relief, ideal for automated placement* High temperature soldering:260°C maximum/...
ES1PC: Features: * Very low profile - typical height of 1.0mm* For surface mount application* Glass passivated chip junction* Ultrafast recovery times for high efficiency* Low forward voltage, low power lo...
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Parameter |
Symbol |
ES1PA |
ES1PB |
ES1PC |
ES1PD |
Unit |
Device marking code |
EA |
EB |
EC |
ED |
||
Maximum reverse voltage |
VRM |
50 |
100 |
150 |
200 |
V |
Maximum average forward rectified current see Fig.1 |
IF(AV) |
1.0 |
A | |||
Peak forward surge current 10ms single half sine-wave |
IFSM |
30 |
A | |||
Typical thermal resistance(1) |
RJA |
105 |
/W | |||
Operating junction and Storage temperature range |
TJ, TSTG |
55 to +150 |