Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering: 250/10 seconds at terminalsSpecifications Parameter Symbol ES07B ES07D Unit Device marking code EB ED Maxim...
ES07B: Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering: 250/10 seconds at terminalsSpecifications ...
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• For surface mounted applications
• Low profile package
• Ideal for automated placement
• High temperature soldering: 250/10 seconds at terminals
Parameter |
Symbol |
ES07B |
ES07D |
Unit |
Device marking code |
EB |
ED |
||
Maximum repetitive peak reverse voltage |
VRRM |
100 |
200 |
V |
Maximum RMS voltage |
VRMS |
70 |
140 |
V |
Maximum DC blocking voltage |
VDC |
100 |
200 |
V |
Maximum average forward rectified current |
IF(AV) |
0.7 |
A | |
Peak forward surge current 8.3ms single half sine-wave TL = 25 |
IFSM |
30 |
A | |
Typical thermal resistance (on ceramic substrate) (on epoxy substrate) |
RJA |
55 120 |
/W | |
Operating junction and storage temperature range |
TJ, TSTG |
55 to +125 |