EPF10K130EFC484-3

The EPF10K130EFC484-3 is one member of the EPF10K130 family which is designed as the enhanced versions of FLEX 10K device. This device enables 100% testing prior to shipment and allows the designer to focus on simulation and design verification. FLEX 10KE reconfigurability eliminates inventory management for gate array designs and generation of test vectors for fault coverage. All performance values of this device were obtained with Synopsys DesignWare or LPM functions.

Features of the EPF10K130EFC484-3 are:(1)High density: 30,000 to 200,000 typical gates and Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be used without reducing logic capacity;(2)Low power consumption;(3)Bidirectional I/O performance (tSU and tCO) up to 212 MHz;(4)Fully compliant with the PCI Special Interest Group (PCI SIG);(5)-1 speed grade devices are compliant with PCI Local Bus Specification, Revision 2.2, for 5.0-V operation;(6)Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic;(7)Fabricated on an advanced process and operate with a 2.5-V internal supply voltage;(8)In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port;(9)Built-in low-skew clock distribution trees;(10)100% functional testing of all devices; test vectors or scan chains are not required.

The absolute maximum ratings of the EPF10K130EFC484-3 can be summarized as:(1)Supply voltage:0.5 to 3.6 V;(2)DC input voltage:2.0 to 5.75 V;(3)DC output current, per pin:25 to 25 mA;(4)Storage temperature:65 to 150 °C;(5)Ambient temperature:65 to 135 °C;(6)Junction temperature (PQFP, TQFP, BGA, and FineLine BGA packages, under bias): 135 °C;(7)Junction temperature (Ceramic PGA packages, under bias):150 °C. If you want to know more information such as the electrical characteristics about the EPF10K130EFC484-3, please download the datasheet in www.seekic.com or www.chinaicmart.com.