Features: • Integrated LPF designed to work with Broadcom's BCM3033, BCM3137 and BCM3210 Chips• Robust construction to meet IR/VP soldering processes• Add -RC after part number for RoHS Compliant• Available in SMD, DIP and DIL Packages
EPB5206G: Features: • Integrated LPF designed to work with Broadcom's BCM3033, BCM3137 and BCM3210 Chips• Robust construction to meet IR/VP soldering processes• Add -RC after part number f...
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