EGP30M

Features:

` GPRC (Glass Passivated Rectifier Chip) inside
` Glass passivated cavity-free junction
` Superfast recovery time for high efficiency
` Low forward voltage , high current capability
` Low leakage current
` High surge current capability
` High temperature soldering guaranteed: 260/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3 kg) tension
` Plastic package has Underwriters Laboratory Flammability Classification 94V-0

Specifications

Ratings at 25 ambient temperature unless otherwise specified.	SYMBOLS	EGP30								UNITS
		A	B	D	F	G	J	K	M
Maximum repetitive peak reverse voltage	VRRM	50	100	200	300	400	600	800	1000	Volts
Maximum RMS voltage	VRMS	35	70	140	210	280	420	560	700	Volts
Maximum DC blocking voltage	VDC	50	100	200	300	400	600	800	1000	Volts
Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55	I(AV)	3.0								Amps
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method)	IFSM	125						115		Amps
Maximum instantaneous forward voltage at 1.0A	VF	1.0				1.25		1.7		Volts
Maximum DC reverse currentTA=25 at rated DC blocking voltageTA=125 TA=150	IR	5 50 120						5 120 -		A
Maximum reverse recovery time (NOTE 1)	trr	50						75		ns
Typical junction capacitance (NOTE 2)	CJ	75								pF
Typical thermal resistance (NOTE 3)	RJA RJL	20 8								/W
Operating junction and storage temperature range	TJ, TSTG	-65 to +175						-55 to +150

NOTES : (1) Reverse recovery test condition : I_F 0.5A, I_R=1.0A, I_rr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead lengths, P.C.B. mounted.