Features: ` GPRC (Glass Passivated Rectifier Chip) inside` Glass passivated cavity-free junction` Superfast recovery time for high efficiency` Low forward voltage , high current capability` Low leakage current` High surge current capability` High temperature soldering guaranteed: 260/10 seconds, 0...
EGP15M: Features: ` GPRC (Glass Passivated Rectifier Chip) inside` Glass passivated cavity-free junction` Superfast recovery time for high efficiency` Low forward voltage , high current capability` Low leak...
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Ratings at 25 ambient temperature unless otherwise specified. |
SYMBOLS |
EGP15 |
UNITS | |||||||
A |
B |
D |
F |
G |
J |
K |
M | |||
Maximum repetitive peak reverse voltage |
VRRM |
50 |
100 |
200 |
300 |
400 |
600 |
800 |
1000 |
Volts |
Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
210 |
280 |
420 |
560 |
700 |
Volts |
Maximum DC blocking voltage |
VDC |
50 |
100 |
200 |
300 |
400 |
600 |
800 |
1000 |
Volts |
Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55 |
I(AV) |
1.5 |
Amp | |||||||
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) |
IFSM |
50 |
45 |
Amps | ||||||
Maximum instantaneous forward voltage at 1.0A |
VF |
1.0 |
1.25 |
1.7 |
Volts | |||||
Maximum DC reverse currentTA=25 C at rated DC blocking voltageTA=125oC TA=150oC |
IR |
5 30 80 |
5 80 - |
A | ||||||
Maximum reverse recovery time (NOTE 1) |
trr |
50 |
75 |
ns | ||||||
Typical junction capacitance (NOTE 2) |
CJ |
35 |
pF | |||||||
Typical thermal resistance (NOTE 3) |
RJA RJL |
40 15 |
/W | |||||||
Operating junction and storage temperature range |
TJ, TSTG |
-65 to +175 |
-55 to +150 |