Features: Encased in ceramic packageHigh reliability against soldering heat and mechanical stressMoisture-proof sealingLow Profile Type (1.8 mm maximum in thickness)Designed for reflow solderingFlat-bottom plate for better mountingsContributes simplification of oscillation circuits and reduces the...
EFOS8004B5: Features: Encased in ceramic packageHigh reliability against soldering heat and mechanical stressMoisture-proof sealingLow Profile Type (1.8 mm maximum in thickness)Designed for reflow solderingFlat...
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Features: Encased in ceramic packageHigh reliability against soldering heat and mechanical stressM...
Features: Encased in ceramic packageHigh reliability against soldering heat and mechanical stressM...
Features: Encased in ceramic packageHigh reliability against soldering heat and mechanical stressM...
Part Number | Oscillation Frequency(to) |
Loop Gain(G) |
Temperature |
Built-inCapacitors (Reference) | |
Bulk Pack | Embossed Taping | ||||
EFOS3584B5 | EFOS3584E5 | 3.58 MHz ±0.5 % | 10 dB min. | Maximum frequency drift:±0.2 %, -20 to 80 | 33 pF |
EFOS4004B5 | EFOS4004E5 | 4.00 MHz ±0.5 % | |||
EFOS8004B5 | EFOS8004E5 | 8.00 MHz ±0.5 % | |||
EFOS1005B5 | EFOS1005E5 | 10.00 MHz ±0.5 % | 15 dB min. | Maximum frequency drift:±1.0 %, -20 to 80 | 33 pF |
EFOS1205B5 | EFOS1205E5 | 12.00 MHz ±0.5 % | |||
EFOB1605B5 | EFOB1605E5 | 16.00 MHz ±0.5 % | 15 dB min. | 33 pF | |
EFOB1695B5 | EFOB1695E5 | 16.93 MHz ±0.5 % | |||
EFOB2005B5 | EFOB2005E5 | 20.00 MHz ±0.5 % | |||
EFOJ3205B5 | EFOJ3205E5 | 32.00 MHz ±0.5 % | 6 dB min. | Maximum frequency drift:±0.2 %, -20 to 80C | 10 pF |
EFOJ3385B5 | EFOJ3385E5 | 33.868 MHz ±0.5 % | |||
EFOJ4005B5 | EFOJ4005E5 | 40.00 MHz ±0.5 % |