Features: · Surface mount design, and tape and reel packaging facilitate automated PCB assembly· Compact size makes these sensors ideal for use in applications with restricted space·High-resolution sensing with phototransistor output·Dual channel model that is ideal for encoder applications (EE-SX...
EE-SX11071109: Features: · Surface mount design, and tape and reel packaging facilitate automated PCB assembly· Compact size makes these sensors ideal for use in applications with restricted space·High-resolution ...
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Item |
Symbol |
Rated value | |
Emitter |
Forward current |
IF |
25 mA (see note) |
Pulse forward current |
IFP |
100 mA (duty: 1/100, pulse width: 0.1 ms) | |
Reverse voltage |
VR |
5 V | |
Receiver |
Collector-emitter voltage |
VCEO |
20V |
Emitter-collector voltage |
VECO |
5 V | |
Collector current |
IC |
20 mA | |
Collector dissipation |
PC |
75 mW (see note) | |
Ambient temperature |
Operating |
Topr |
-30° to 85°C |
Storage |
Tstg |
-40° to 90°C | |
Soldering |
Tsol |
240°C (10 second max) |
Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range.