EE-SX11071108

Features: · Surface mount design, and tape and reel packaging facilitate automated PCB assembly· Compact size makes these sensors ideal for use in applications with restricted space·High-resolution sensing with phototransistor output·Dual channel model that is ideal for encoder applications (EE-SX...

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EE-SX11071108 Picture
SeekIC No. : 004334281 Detail

EE-SX11071108: Features: · Surface mount design, and tape and reel packaging facilitate automated PCB assembly· Compact size makes these sensors ideal for use in applications with restricted space·High-resolution ...

floor Price/Ceiling Price

Part Number:
EE-SX11071108
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/21

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Product Details

Description



Features:

· Surface mount design, and tape and reel packaging facilitate automated PCB assembly
· Compact size makes these sensors ideal for use in applications with restricted space
·High-resolution sensing with phototransistor output
·Dual channel model that is ideal for encoder applications (EE-SX1131)



Specifications

Item
Symbol
Rated value
Emitter
Forward current
IF
25 mA (see note)
Pulse forward current
IFP
100 mA (duty: 1/100, pulse width: 0.1 ms)
Reverse voltage
VR
5 V
Receiver
Collector-emitter voltage
VCEO
20V
Emitter-collector voltage
VECO
5 V
Collector current
IC
20 mA
Collector dissipation
PC
75 mW (see note)

Ambient temperature
Operating
Topr
-30° to 85°C
Storage
Tstg
-40° to 90°C
Soldering
Tsol
240°C (10 second max)

Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range.




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