DS90CF383

Features: ·20 to 65 MHz shift clock support·Single 3.3V supply·Chipset (Tx + Rx) power consumption < 250 mW (typ)·Power-down mode (< 0.5 mW total)·Single pixel per clock XGA (1024x768) ready·Supports VGA, SVGA, XGA and higher addressability.·Up to 227 Megabytes/sec bandwidth·Up to 1.8 Gbps t...

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DS90CF383 Picture
SeekIC No. : 004329336 Detail

DS90CF383: Features: ·20 to 65 MHz shift clock support·Single 3.3V supply·Chipset (Tx + Rx) power consumption < 250 mW (typ)·Power-down mode (< 0.5 mW total)·Single pixel per clock XGA (1024x768) ready·S...

floor Price/Ceiling Price

Part Number:
DS90CF383
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

·20 to 65 MHz shift clock support
·Single 3.3V supply
·Chipset (Tx + Rx) power consumption < 250 mW (typ)
·Power-down mode (< 0.5 mW total)
·Single pixel per clock XGA (1024x768) ready
·Supports VGA, SVGA, XGA and higher addressability.
·Up to 227 Megabytes/sec bandwidth
·Up to 1.8 Gbps throughput
·Narrow bus reduces cable size and cost
·290 mV swing LVDS devices for low EMI
·PLL requires no external components
·Low profile 56-lead TSSOP package
·Falling edge data strobe Transmitter
·Compatible with TIA/EIA-644 LVDS standard
·ESD rating > 7 kV
·Operating Temperature: −40°C to +85°C



Pinout

  Connection Diagram


Specifications

Supply Voltage (VCC)                                                                  −0.3V to +4V
CMOS/TTL Input Voltage                                                −0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage                                           −0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature                                                                         +150°C
Storage Temperature                                                         −65°C to +150°C
Lead Temperature (Soldering, 4 sec)                                                  +260°C
Maximum Package Power Dissipation Capacity @                                    25°C
MTD56 (TSSOP) Package: DS90CF383                                                    1.63 W
Package Derating: DS90CF383                              12.5 mW/°C above +25°C
ESD Rating (HBM, 1.5 kW, 100 pF)                                                           > 7 kV



Description

The DS90CF383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec.

This chipset DS90CF383 is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.


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