DS90CF363

Features: ·20 to 65 MHz shift clock support·Single 3.3V supply·Chipset (Tx + Rx) power consumption < 250 mW (typ)·Power-down mode (< 0.5 mW total)·Single pixel per clock XGA (1024x768) ready·Supports VGA, SVGA, XGA and higher addressability.·Up to 170 Megabytes/sec bandwidth·Up to 1.3 Gbps t...

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DS90CF363 Picture
SeekIC No. : 004329331 Detail

DS90CF363: Features: ·20 to 65 MHz shift clock support·Single 3.3V supply·Chipset (Tx + Rx) power consumption < 250 mW (typ)·Power-down mode (< 0.5 mW total)·Single pixel per clock XGA (1024x768) ready·S...

floor Price/Ceiling Price

Part Number:
DS90CF363
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/20

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Product Details

Description



Features:

·20 to 65 MHz shift clock support
·Single 3.3V supply
·Chipset (Tx + Rx) power consumption < 250 mW (typ)
·Power-down mode (< 0.5 mW total)
·Single pixel per clock XGA (1024x768) ready
·Supports VGA, SVGA, XGA and higher addressability.
·Up to 170 Megabytes/sec bandwidth
·Up to 1.3 Gbps throughput
·Narrow bus reduces cable size and cost
·290 mV swing LVDS devices for low EMI
·PLL requires no external components
·Low profile 48-lead TSSOP package
·Falling edge data strobe Transmitter
·Compatible with TIA/EIA-644 LVDS standard
·ESD rating > 7 kV
·Operating Temperature: −40°C to +85°C



Pinout

  Connection Diagram


Specifications

Supply Voltage (VCC)                                                            −0.3V to +4V
CMOS/TTL Input Voltage                                         −0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage                                    −0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature                                                                  +150°C
Storage Temperature                                                  −65°C to +150°C
Lead Temperature (Soldering, 4 sec)                                           +260°C
Maximum Package Power Dissipation Capacity @                            25°C
MTD48 (TSSOP) Package: DS90CF363                                            1.98 W
Package Derating: DS90CF363                          16 mW/°C above+25°C
ESD Rating (HBM, 1.5 kW, 100 pF)                                                   > 7 kV



Description

The DS90CF363 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 18 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 170 Mbytes/sec.

This chipset DS90CF363 is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.


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