DS90C401

Features:

·Ultra low power dissipation
·Operates above 155.5 Mbps
·Standard TIA/EIA-644
·8 Lead SOIC Package saves space
·Low Differential Output Swing typical 340 mV


Pinout




Specifications

Supply Voltage (VCC)                                              −0.3V to +6V
Input Voltage (DIN)                                   −0.3V to (VCC + 0.3V)
Output Voltage (DOUT+, DOUT−)              −0.3V to (VCC + 0.3V)
Maximum Package Power Dissipation @                          +25°C
M Package                                                                    1068 mW
Derate M Package                                                    8.5 mW/°C
above                                                                              +25°C
Storage Temperature Range                        −65°C to +150°C
Lead Temperature Range
Soldering (4 sec.)                                                          +260°C
Temperature                                                                 +150°C
ESD Rating
(HBM, 1.5 kΩ, 100 pF)                                                  3,500V
(EIAJ, 0 Ω, 200 pF)                                                          250V


Description

The DS90C401 is a dual driver device optimized for high data rate and low power applications. This device along with the DS90C402 provides a pair chip solution for a dual high speed point-to-point interface. The DS90C401 is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8 lead small outline package.
The differential driver outputs provides low EMI with its low output swings typically 340 mV.