Features: Single saturated transistor outputsLow standby power 10 mW typicalHigh impedance TTL compatible inputsOutputs may be tied together for increased current c pacityHigh output current 600 mA per output 24A per packageNo output latch-up at 35VLow output ON voltage (350 MV typ @600 mA)High br...
DS3658: Features: Single saturated transistor outputsLow standby power 10 mW typicalHigh impedance TTL compatible inputsOutputs may be tied together for increased current c pacityHigh output current 600 mA ...
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If MilitaryAerospace specified devices are required please contact the National Semiconductor Sales OfficeDistributors for availability and specifications
SupplyVoltage 7V
InputVoltage 15V
OutputVoltage 70V
OutputCurrent 1.5A
Continuous Power Dissipation
@25Free-Air(Note5) 2075mW
StorageTemperatureRange -65to 150
LeadTemperature(Soldering4sec.) 260
Temperature Min | 0 deg C |
Temperature Max | 70 deg C |
Output Bus | TTL/LS |
Latch-Up Voltage | 35 Volt |
Supply On Current | 65 mA |
OutputLow Voltage | 0.7 Volt |
OutputHigh Voltage | 70 Volt |
OutputLow Current | 600 mA |
Propagation Delay | 2430 ns |
Drivers | 4 |
PowerWise | No |
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The DS3658 quad peripheral driver is designed for those applications where low operating power high breakdown voltage high output current and low output ON voltage are required A unique input circuit combines TTL compatibility with high impedance In fact its extreme low input current allows it to be driven directly by a CMOS device
The outputs are capable of sinking 600 mA each and offer a 70V breakdown However for inductive loads the output should be clamped to 35V or less to avoid latch-up during turn off (inductive fly back protectionrefer AN-213) An on-chip clamp diode capable of handling 800 mA is provided at each output for this purpose In addition the DS3658 incor-porates circuitry that guarantees glitch-free power up or down operation and a fail-safe feature which puts the output in a high impedance state when the input is open
The DS3658 molded package is specifically constructed to allow in-creased power dissipation over conventional packages The four ground pins are directly connected to the device chip with a special copper lead frame When the quad driver is soldered into a PC board the power rating of the device improves significantly