DS21Q554

`  Four (4) Completely Independent T1 or E1 Transceivers
`  In One Small 27mm x 27mm Package
`  Each Transceiver Contains a Short & Long Haul Line Interface
  Plus a Full Featured Framer with Alarm Detection/Generation,
  Elastic Stores, Hardware Based Signaling Support, Per DS0
  Channel Control and HDLC Controller
`  Each Multi-Chip Module (MCM) Contains Four Die of:
  DS21352 (DS21Q352)
  DS21552 (DS21Q552)
  DS21354 (DS21Q354)
  DS21554 (DS21Q554)
`  Selection Guide:
`   Supply   Device
    
  T1   3.3V   DS21Q352
  T1   5V   DS21Q552
  E1   3.3V   DS21Q354
  E1   5V   DS21Q554
`  See the Specific DS21352/DS21552 and DS21354/DS21554
` Data Sheets for Details on their Feature Set and Operation
`  All Four T1 or E1 Transceivers Can be Concatenated into a Single
`  8.192MHz Backplane Data Stream
`  IEEE 1149.1 JTAG-Boundary Scan Architecture
`  DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible
`  to Allow the Same Footprint to Support T1 and E1 Applications
`  256lead MCM BGA package (27mm X 27mm)
`  Low Power 5V CMOS or Low Power 3.3V CMOS with 5V
`  Tolerant Input & Outputs

The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for theDS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.Four silicon die of one of thesedevices is packaged in a Multi-Chip Module (MCM) with the electricalconnections as shown in Figure 1.All of the functions available on the DS21352/DS21552 andDS21354/DS21554 are also available in the MCM packaged version however in order to minimize packagesize, some signals have been deleted. These differences aredetailed in Table 1.

This data sheet describes the electrical connections and the mechanical dimensions only. Please see theDS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and theoperating characteristics of the device.