PinoutDescriptionThe DS10BR150TSD is a single channel 1.0 Gbps LVDS buffer optimized for high-speed signal transmission over lossy FR-4 printed circuit board backplanes and balanced cables. The applications of it are: clock and data buffering, OC-12/STM-4, firewire 800. The features of DS10BR150T...
DS10BR150TSD: PinoutDescriptionThe DS10BR150TSD is a single channel 1.0 Gbps LVDS buffer optimized for high-speed signal transmission over lossy FR-4 printed circuit board backplanes and balanced cables. The appl...
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The DS10BR150TSD is a single channel 1.0 Gbps LVDS buffer optimized for high-speed signal transmission over lossy FR-4 printed circuit board backplanes and balanced cables. The applications of it are: clock and data buffering, OC-12/STM-4, firewire 800.
The features of DS10BR150TSD can be summarized as:(1)DC - 1.0 Gbps low jitter, high noise immunity, low power operation; (2)On-chip 100 input and output termination minimizes; (3)insertion and return losses, reduces component count and minimizes board space; (4)7 kV ESD on LVDS I/O pins protects adjoining components; (5)Small 3 mm x 3 mm 8-LLP space saving package.
The absolute maximum ratings of DS10BR150TSD are:(1)Supply Voltage (VCC):-0.3V to +4V; (2)LVDS Input Voltage (IN+, IN-):-0.3V to +4V; (3)LVDS Differential Input Voltage ((IN+) - (IN-)):0V to 1V; (4)LVDS Output Voltage (OUT+, OUT-) -0.3V to (VCC +0.3V); (5)LVDS Differential Output Voltage ((OUT+) - (OUT-)):0V to 1V; (6)LVDS Output Short Circuit Current Duration:5 ms; (7)Junction Temperature:+150°C; (8)Storage Temperature Range:-65°C to +150°C; (9)Lead Temperature Range Soldering (4 sec.):+260°C; (10)Maximum Package Power Dissipation at 25°C:SDA Package..2.08W, Derate SDA Package..16.7 mW/°C above +25°C; (11)Package Thermal Resistance:JA..+60.0°C/W,JC..+12.3°C/W; (12)HBM 7 kV; (13)MM 250V; (14)CDM 1250V.
If you want to know more information such as the electrical characteristics about the DS10BR150TSD, please download the datasheet in www.seekic.com or www.chinaicmart.com .