DS1009

Features: flexiFLASH™ Architecture• Instant-on• Infinitely reconfigurable• Single chip• FlashBAK™ technology• Serial TAG memory• Design securityLive Update Technology• TransFR™ technology• Secure updates with 128 bit AES encryption&...

product image

DS1009 Picture
SeekIC No. : 004328373 Detail

DS1009: Features: flexiFLASH™ Architecture• Instant-on• Infinitely reconfigurable• Single chip• FlashBAK™ technology• Serial TAG memory• Design securityLive U...

floor Price/Ceiling Price

Part Number:
DS1009
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/1/10

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

flexiFLASH™ Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
• Serial TAG memory
• Design security
Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP™ Block
• Three to eight blocks for high performance
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO™ buffer supports:
LVCMOS 33/25/18/15/12; LVTTL
SSTL 33/25/18 class I, II
HSTL15 class I; HSTL18 class I, II
PCI
LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply





Specifications

Supply Voltage VCC . . . . . . . . . . . . . . . .. . -0.5 to 1.32V
Supply Voltage VCCAUX . . . . . . . . . . . . . . . -0.5 to 3.75V
Supply Voltage VCCJ . . . . . . . . . . . . . . . . . -0.5 to 3.75V
Supply Voltage VCCPLL4 . . . . . . . . . . . . . . .-0.5 to 3.75V
Output Supply Voltage VCCIO . . . . . . . . . . -0.5 to 3.75V
Input or I/O Tristate Voltage Applied5 . . . .-0.5 to 3.75V
Storage Temperature (Ambient) . . . . . . . . . -65 to 150
Junction Temperature Under Bias (Tj) . . . . . . . . . +125
1. Stress above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
2. Compliance with the Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. VCCPLL only available on csBGA, PQFP and TQFP packages.
5. Overshoot and undershoot of -2V to (VIHMAX + 2) volts is permitted for a duration of <20ns.






Description

DS1009 combine a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cell s in an architecture referred to as flexiFLASH.

The flexiFLASH approach provides benefits including instant-on, infinite reconfigurability, on chip storage with FlashBAK embedded block memory and Serial TAG memory and design security. The parts also support Live
Update technology with TransFR, 128-bit AES Encryption and Dual-boot technologies.

The DS1009 FPGA fabric was optimized for the new technology from the outset with high performance and low cost in mind. LatticeXP2 devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support and enhanced sysDSP blocks.

The ispLEVER®design tool from Lattice allows large and complex designs to be efficiently implem ented using the LatticeXP2 family of FPGA devices. Synthesis library support for LatticeXP2 is available for popular logic synthesis tools. The ispLEVER tool uses the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the v. The ispLEVER tool extracts the timing from the routing and back-annotates it into the design for timing verification.

Lattice provides many pre-designed Intellectual Property (IP) ispLeverCORE™ modules for the DS1009 family.

By using these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design,increasing their productivity.






Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
Isolators
Semiconductor Modules
Inductors, Coils, Chokes
Test Equipment
Cables, Wires - Management
View more