SeekIC No. : 004326567
Detail
DIP20: Specifications item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue( silver glue ) 10-40 µm 0.01 W/cm°C molding comp...
DIP20 Data Sheetfloor Price/Ceiling Price
- Part Number:
- DIP20
- Supply Ability:
- 5000
Price Break
- Qty
- 1~5000
- Unit Price
- Negotiable
- Processing time
- 15 Days
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Month Sales
268 Transactions
Payment Methods
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