Features: ` 10s Short Circuit Withstand` High Thermal Cycling Capability` Soft Punch Through Silicon` Isolated MMC Base-plate with AIN SubstrateApplication· Choppers· Motor controllers· Power suppliesSpecificationsStresses above those listed under 'Absolute Maximum Ratings' may cause permanent dam...
DIM800ECM33-F000: Features: ` 10s Short Circuit Withstand` High Thermal Cycling Capability` Soft Punch Through Silicon` Isolated MMC Base-plate with AIN SubstrateApplication· Choppers· Motor controllers· Power suppli...
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Features: 10s Short Circuit WithstandHigh Thermal Cycling CapabilityNon Punch Through SiliconIsola...
Symbol | Parameter | Test Conditions |
Max. |
Units |
VCES | Collector-emitter voltage | VGE = 0V |
3300 |
V |
VGES | Gate-emitter voltage |
±20 |
V | |
IC | Continuous collector current | Tcase = 90˚C |
800 |
A |
IC(PK) | Peak collector current | 1ms, Tcase = 115˚C |
1600 |
A |
Pmax | Max. transistor power dissipation | Tcase = 25˚C, Tj = 150˚C |
10. |
kW |
I2t | Diode I2t value | VR = 0, tp = 10ms, Tvj = 125˚C |
320 |
kA2S |
Visol | Isolation voltage - per module | Commoned terminals to base plate. AC RMS, 1 min, 50Hz |
6000 |
V |
QPD | Partial discharge - per module | IEC1287. V1 = 3500V, V2 = 2600V, 50Hz RMS |
10 |
PC |
The Powerline range of high power modules includes half bridge, chopper, dual, single and bidirectional switch configurations covering voltages from 600V to 3300V and currents up to 3600A.
The DIM800ECM33-F000 is a 3300V, soft punch through, n channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10ms short circuit withstand. DIM800ECM33-F000 is optimised for traction drives and other applications requiring high thermal cycling capability.
The module DIM800ECM33-F000 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.