Features: ` 10s Short Circuit Withstand` Soft Punch Through Silicon` Lead Free construction` Isolated MMC Base with AlN Substrates` High Thermal Cycling CapabilityApplication· High Reliability Inverters· Motor Controllers· Traction Drives· ChoppersSpecificationsStresses above those listed under 'A...
DIM400NSM33-F000: Features: ` 10s Short Circuit Withstand` Soft Punch Through Silicon` Lead Free construction` Isolated MMC Base with AlN Substrates` High Thermal Cycling CapabilityApplication· High Reliability Inver...
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Symbol | Parameter | Test Conditions |
Max. |
Units |
VCES | Collector-emitter voltage | VGE = 0V |
3300 |
V |
VGES | Gate-emitter voltage |
±20 |
V | |
IC | Continuous collector current | Tcase =90˚C |
400 |
A |
IC(PK) | Peak collector current | 1ms, Tcase = 115˚C |
800 |
A |
Pmax | Max. transistor power dissipation | Tcase = 25˚C, Tj = 150˚C |
5.2 |
kW |
Visol | Isolation voltage - per module | Commoned terminals to base plate. AC RMS,1 min, 50Hz |
6000 |
V |
QPD | Partial discharge - per module | IEC1287. V1 = 3500V, V2 = 2600V, 50Hz RMS |
10 |
PC |
The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 6500V and currents up to 3400A.
The DIM400NSM33-F000 is a single switch 3300V, soft punch through n-channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus 10us short circuit withstand. This device is optimised for traction drives and other applications requiring high thermal cycling capability.
The module DIM400NSM33-F000 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.