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DG3002

Features: MICRO FOOT Chip Scale Package (1.0 x 1.5 mm)Low Voltage Operation (1.8 V to 5.5 V)Low On-Resistance - rDS(on): 0.4 Fast Switching - tON : 47ns, tOFF: 40 nsLow Power ConsumptionTTL/CMOS CompatibleApplicationCellular PhonesCommunication SystemsPortable Test EquipmentBattery Operated System...

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SeekIC No. : 004326145 Detail

DG3002: Features: MICRO FOOT Chip Scale Package (1.0 x 1.5 mm)Low Voltage Operation (1.8 V to 5.5 V)Low On-Resistance - rDS(on): 0.4 Fast Switching - tON : 47ns, tOFF: 40 nsLow Power ConsumptionTTL/CMOS Com...

DG3002 Data Sheet

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Part Number:
DG3002
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

MICRO FOOT Chip Scale Package (1.0 x 1.5 mm)
Low Voltage Operation (1.8 V to 5.5 V)
Low On-Resistance - rDS(on): 0.4
Fast Switching - tON : 47ns, tOFF: 40 ns
Low Power Consumption
TTL/CMOS Compatible




Application

Cellular Phones
Communication Systems
Portable Test Equipment
Battery Operated Systems
PCM Cards
PDA




Pinout

Connection Diagram




Specifications

Reference to GND
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6 V
IN, COM, NC, NOa . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . -0.3 to (V+ + 0.3 V)
Continuous Current (Any terminal) . . . . . . . . . . . . . . . . . . . . . . . . . . ±250 mA
Peak Current . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . .±400 mA
(Pulsed at 1 ms, 10% duty cycle)
Storage Temperature (D Suffix) . . . . . . . .. . . . . . . . . . . . . . . . . -65 to 150°C
Power Dissipation (Packages)b
VPR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . 215°C
IR/Convection . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Power Dissipation (Packages)c
6-Bump, 2 x 3 MICRO FOOTd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mW
Notes:
a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC Board.
c. Derate3.1 mW/above 70




Description

The DG3001/DG3002/DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as SPST switches, and the DG3003 is an SPDT switch. Combining low power, high speed (tON: 47 ns, tOFF: 40 ns), low on-resistance (r DS(on) : 0.4 ) and small physical size (MICRO FOOT, 6-bump), the DG3001/DG3002/DG3003 are ideal for portable and battery powered applications requiring high performance and efficient use of board space.

The DG3001/DG3002/DG3003 are built on Vishay Siliconix's low voltage JI2 process. An epitaxial layer prevents latchup.






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