DescriptionThe DAC-8221 is a kind of dual 12-bit buffered multiplying CMOS D/A converter. The device combines two identical 12-bit, multiplying, digital-to-analog converters into a single CMOS chip. The device is eletrically similar to DAC8212 with improved microprocessor interface timing and is p...
DAC-8221: DescriptionThe DAC-8221 is a kind of dual 12-bit buffered multiplying CMOS D/A converter. The device combines two identical 12-bit, multiplying, digital-to-analog converters into a single CMOS chip....
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The DAC-8221 is a kind of dual 12-bit buffered multiplying CMOS D/A converter. The device combines two identical 12-bit, multiplying, digital-to-analog converters into a single CMOS chip. The device is eletrically similar to DAC8212 with improved microprocessor interface timing and is packaged in a narrow 0.300" DIP. The device includes two thin-film R-2R resistor-ladder networks, two 12-bit data latches, one 12-bit input buffer, and control logic. The device operates on a single supply from +5 V to +15 V. The typical applications include automatic test equipment, industrial automation, robotics/process control, programmable instrumental equipment, digital gain/attenuation control and ideal for battery-operated equipment.
There are some features of DAC-8221as follows: (1)two matched 12-bit DACs on one chip; (2)packaged in a narrow 0.3" 24-pin DIP; (3)direct parallel load of all 12 bits for high data throughout; (4)on-chip latches for both DACs; (5)12-bit endpont linearity (±1/2 LSB) over temperature; (6)+5 V to +15 V single supply operation; (7)DACs matched to 0.2% typically; (8)four-quadrant multiplication; (9)improved ESD resistance; (10)available in Die Form.
The following is about the absolute maximum ratings of DAC-8221 (TA=+25): (1)VDD to AGND: 0 to +17 V; (2)VDD to DGND: 0 to +17 V; (3)AGND to DGND: VDD+0.3 V; (4)DGND to AGND: -0.3 to VDD+0.3 V; (5)digital input voltage to DGND: -0.3 to VDD+0.3 V; (6)IOUTA, IOUTB to AGND: -0.3 to VDD+0.3 V; (7)VREFA, VREFB to AGND: ±25 V; (8)VRFBA, VRFBB to AGND: ±25 V; (9)operating temperature range: AW version: -55 to +125; EW, FW, FP versions: -40 to +85; GP, HP, HS versions: 0 to +70; (10)junction temperature: +150; (11)storage temperature: -65 to 150; (12)lead temperature (soldering, 10secs): +300.