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D8SB30

Features: Glass passivated junction chipIdeal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueSurge overload rating: 175 A peak High temperature soldering guaranteed:250 oC/10sec/ 0.375 (9.5mm) lead lengthat 5 lbs tensionPinoutSpecifications RATINGS ...

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SeekIC No. : 004323520 Detail

D8SB30: Features: Glass passivated junction chipIdeal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueSurge overload rating: 175 A peak High temperature soldering g...

D8SB30 Data Sheet

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Part Number:
D8SB30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

Glass passivated junction chip
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
Surge overload rating: 175 A peak
High temperature soldering guaranteed:
250 oC/10sec/ 0.375" (9.5mm) lead length
at 5 lbs tension


Pinout

Connection Diagram


Specifications

RATINGS SYMBOL



 D8SB D8SB D8SB D8SB D8SB D8SB

100 200 400 600 800 1000		 UNITS



Maximum Repetitive Peak Reverse Voltag VRRM
10 20 40 60 80 100		 V
Maximum RMS Voltage VRMS
 100 200 400 600 800 1000 V
Maximum DC Blocking Voltage VDC
 70 140 280 420 560 700 A
Maximum Average Forward Rectified Current
o
Ta=70 C)

IF(AV)

8.0

 A

Peak Forward Surge Current (8.3ms single
half sine-wave superimposed on rated load)

IFSM

175

 V
Maximum Instantaneous Forward Voltage
(at forward current 4.0A DC)

VF

1.1

 A
Maximum DC Reverse Current Ta=25o C
(at rated DC blocking voltage) Ta=125o C

IR

5
500

 A

Storage and Operating Junction Temperature

TSTG,TJ

-55 to + 150

 oC



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