D1861B

Features: Direct-modulated 1310 nm laser module characterized for use in 10 Gbits/s operations up to 12 kmAverage optical output power, 3 dBm typicalTemperature stabilized with internal thermoelectric cooler (TEC), enabling operation within a wide temperature range of 5 °C to +80 °CHermetically ...

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SeekIC No. : 004321258 Detail

D1861B: Features: Direct-modulated 1310 nm laser module characterized for use in 10 Gbits/s operations up to 12 kmAverage optical output power, 3 dBm typicalTemperature stabilized with internal thermoelectr...

floor Price/Ceiling Price

Part Number:
D1861B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/21

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Product Details

Description



Features:

 Direct-modulated 1310 nm laser module characterized
   for use in 10 Gbits/s operations up to 12 km
 Average optical output power, 3 dBm typical
 Temperature stabilized with internal thermoelectric
   cooler (TEC), enabling operation within a wide
   temperature range of 5 °C to +80 °C
 Hermetically sealed optics, isolator on TEC
 GPO* RF connector
 Single-mode fiber pigtail
 High relaxation frequency at low bias



Application

 SR-1
 SONET/SDH low-cost metro applications
 High-speed data communications
 DWDM equipment drop-side applications



Specifications

Parameter

Symbol

Min

Max

Unit

Operating Temperature Range

TA

40

80

°C

Storage Temperature Range

Tstg

40

85

°C

Laser Forward Bias

-

-

150

mA

Pin 3, Max. Positive Voltage1

VR

-

1

V

Pin 3, Max. Positive Current1

IR

-

200

mA

Reverse Voltage Photodiode

VRPD

-

20

V




Description

The D1861B direct-modulated laser (DML) module is a cost-effective solution for 10 Gbits/s digital transmission up to 12 km using traditional intracity SMF-28 † single-mode fiber links. The 1310 nm wavelength eliminates the need for concern about dispersion control over most installed intracity fiber plants. The package of the  D1861B contains a high-speed DFB laser chip, thermoelectric cooler, thermistor, optical isolator, and a rear-facet monitor photodiode, which allows for external optical power control.




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