D1002

Features: Wide Band Driver Amplifier9.0 dB Small Signal Gain5.0 dB Noise Figure15.0 dB Gain Control+9.0 dBm P1dB Compression Point100% On-Wafer RF, DC and Output Power Testing100% Visual Inspection to MIL-STD-883 Method 2010SpecificationsSupply Voltage (Vd) +10.0 VDCSupply Current (Id) 150 mAGate ...

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SeekIC No. : 004321001 Detail

D1002: Features: Wide Band Driver Amplifier9.0 dB Small Signal Gain5.0 dB Noise Figure15.0 dB Gain Control+9.0 dBm P1dB Compression Point100% On-Wafer RF, DC and Output Power Testing100% Visual Inspection ...

floor Price/Ceiling Price

Part Number:
D1002
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

Wide Band Driver Amplifier
9.0 dB Small Signal Gain
5.0 dB Noise Figure
15.0 dB Gain Control
+9.0 dBm P1dB Compression Point
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd)                            +10.0 VDC
Supply Current (Id)                             150 mA
Gate Bias Voltage (Vg)                        +0.3 VDC
Input Power (Pin)                                +18 dBm
Storage Temperature (Tstg)               -65 to +165
Operating Temperature (Ta)               -55 to MTTF Table2
Channel Temperature (Tch)                 MTTF Table2

(2) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's D1002 0.05-50.0 GHz GaAs MMIC distributed amplifier has a small signal gain of 9.0 dB with a noise figure of 5.0 dB across the band. The device also includes 15.0 dB gain control and a +9.0 dBm P1dB compression point. This MMIC uses Mimix Broadband's D1002 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. D1002 is well suited for microwave, millimeter-wave, wideband military, and fiber optic applications.




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