CY7C199B

Features: • High speed-10 ns• Fast tDOE• CMOS for optimum speed/power• Low active power-495 mW (max, 10 ns L version)• Low standby power-0.275 mW (max, L version)• 2V data retention ( L version only)• Easy memory expansion with CE and OE features̶...

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CY7C199B Picture
SeekIC No. : 004320266 Detail

CY7C199B: Features: • High speed-10 ns• Fast tDOE• CMOS for optimum speed/power• Low active power-495 mW (max, 10 ns L version)• Low standby power-0.275 mW (max, L version)&#...

floor Price/Ceiling Price

Part Number:
CY7C199B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• High speed
-10 ns
• Fast tDOE
• CMOS for optimum speed/power
• Low active power
-495 mW (max, 10 ns "L" version)
• Low standby power
-0.275 mW (max, "L" version)
• 2V data retention ("L" version only)
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselecte



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines,
not tested.)
Storage Temperature ................................. 65°C to +150°C
Ambient Temperature with
Power Applied............................................. 55°C to +125°C
Supply Voltage to Ground Potential
(Pin 28 to Pin 14) ........................................... 0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] ................................... 0.5V to VCC + 0.5V
DC Input Voltage[1] ................................0.5V to VCC + 0.5V
Output Current into Outputs (LOW) ............................. 20 mA
Static Discharge Voltage ............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current...................................................... >200 mA



Description

The CY7C199B is a high-performance CMOS static RAM organized as 32,768 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE) and active LOW Output Enable (OE) and three-state drivers. The CY7C199B  has an automatic power-down feature, reducing the power consumption by 81% when deselected. The CY7C199B is in the standard 300-mil-wide DIP, SOJ, and LCC packages.

An active LOW Write Enable signal (WE) of CY7C199B controls the writing/ reading operation of the memory. When CE and WE inputs are both LOW, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A14).

Reading the CY7C199B is accomplished by selecting the CY7C199B  and enabling the outputs, CE and OE active LOW, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins.

The input/output pins of CY7C199B remain in a high-impedance state unless the chip is selected, outputs are enabled, and Write Enable (WE) is HIGH. A die coat is used to improve alpha immunity.




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