CY7C1380DV25

Features: • Supports bus operation up to 250 MHz• Available speed grades are 250, 200 and 167 MHz• Registered inputs and outputs for pipelined operation• 2.5V core power supply• Fast clock-to-output times- 2.6 ns (for 250-MHz device)- 3.0 ns (for 200-MHz device)- 3.4 ...

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CY7C1380DV25 Picture
SeekIC No. : 004320050 Detail

CY7C1380DV25: Features: • Supports bus operation up to 250 MHz• Available speed grades are 250, 200 and 167 MHz• Registered inputs and outputs for pipelined operation• 2.5V core power supp...

floor Price/Ceiling Price

Part Number:
CY7C1380DV25
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200 and 167 MHz
• Registered inputs and outputs for pipelined operation
• 2.5V core power supply
• Fast clock-to-output times
- 2.6 ns (for 250-MHz device)
- 3.0 ns (for 200-MHz device)
- 3.4 ns (for 167-MHz device)
• Provide high-performance 3-1-1-1 access rate
• User-selectable burst counter supporting Intel® Pentium® interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Single Cycle Chip Deselect
• Available in JEDEC-standard lead-free 100-pin TQFP, lead-free and non lead-free 119-ball BGA package and 165-ball FBGA package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• "ZZ" Sleep Mode Option



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .................................65°C to +150°C
Ambient Temperature with
Power Applied.............................................55°C to +125°C
Supply Voltage on VDD Relative to GND............ 0.3V to +3.6V
DC Voltage Applied to Outputs
in Tri-State........................................... 0.5V to VDDQ + 0.5V
DC Input Voltage.....................................0.5V to VDD + 0.5V
Current into Outputs (LOW)........................................... 20 mA
Static Discharge Voltage.............................................. >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... >200 mA



Description

The CY7C1380DV25/CY7C1382DV25 SRAM integrates 512K x 36 and 1M x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs of CY7C1380DV25/CY7C1382DV25 are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depthexpansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, andADV), Write Enables (BWX, and BWE), and Global Write (GW). Asynchronous inputs of CY7C1380DV25/CY7C1382DV25 include the Output Enable (OE) and the ZZ pin.

Addresses and chip CY7C1380DV25/CY7C1382DV25 enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV).

Address, data inputs, and write controls of CY7C1380DV25/CY7C1382DV25 are registered on-chip to initiate a self-timed Write cycle.This part supports Byte Write operations (see Pin Descriptions and Truth Table for further details). Write cycles CY7C1380DV25/CY7C1382DV25 can be one to two or four bytes wide as controlled by the byte write control inputs. GW when active LOW causes all bytes to be written.

The CY7C1380DV25/CY7C1382DV25 operates from a +2.5V core power supply while all outputs may operate with a +2.5 supply. All inputs and outputs are JEDEC-standard JESD8-5- compatible.




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