CY7C1365V25

Features: • Supports 113-MHz bus operations• 256K x 36 / 256K x 32 / 512K x 18 common I/O• Fast clock-to-output times -7.5 ns (for 117-MHz device) -8.5 ns (for 100-MHz device) -10.0 ns (for 80-MHz device)• Two-bit wrap-around counter supporting either interleaved or linear ...

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SeekIC No. : 004320014 Detail

CY7C1365V25: Features: • Supports 113-MHz bus operations• 256K x 36 / 256K x 32 / 512K x 18 common I/O• Fast clock-to-output times -7.5 ns (for 117-MHz device) -8.5 ns (for 100-MHz device) -10....

floor Price/Ceiling Price

Part Number:
CY7C1365V25
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/17

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Product Details

Description



Features:

• Supports 113-MHz bus operations
• 256K x 36 / 256K x 32 / 512K x 18 common I/O
• Fast clock-to-output times
   -7.5 ns (for 117-MHz device)
   -8.5 ns (for 100-MHz device)
  -10.0 ns (for 80-MHz device)
• Two-bit wrap-around counter supporting either interleaved or linear burst sequences
• Separate processor and controller address strobes provide direct interface with the processor and external cache controller
• Synchronous self-timed writes
• Asynchronous output enable
• Single 2.5V Power supply
• JEDEC-standard pinout
• Available as a 100-pin TQFP or 119 BGA
• "ZZ" Sleep Mode option



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines only, not tested.)
Storage Temperature ................................. 65°C to +150°C
Ambient Temperature with
Power Applied............................................. 55°C to +125°C
Supply Voltage on VDD Relative to GND........ 0.5V to +3.6V
DC Voltage Applied to Outputs
in High Z State[9] ................................. 0.5V to VDDQ + 0.5V
DC Input Voltage[9] ..............................0.5V to VDDQ + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA



Description

The CY7C1361V25, CY7C1365V25 and CY7C1363V25 are 2.5v, 256K x 36, 256K x 32 and 512K x 18 synchronousflowthrough SRAM designed to interface with high-speed microprocessors with minimal glue logic. Maximum access delay from the clock rise is 7.5 ns (117-MHz device). A 2-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access.

The CY7C1361V25/CY7C1365V25/CY7C1363V25 supports either the interleaved or linear burst sequences, selected by the MODE input pin. A HIGH selects an interleaved burst sequence, while a LOW selects a linear burst sequence. Burst accesses of CY7C1361V25, CY7C1365V25 and CY7C1363V25 can be initiated by asserting either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC) at clock rise. Address advancement through the burst sequence is controlled by the ADV input. Byte write operations are qualified with the Byte Write Select (BWa,b,c,d for CY7C1361V25/CY7C1365V25 and BWa,b for CY7C1363V25) inputs. A Global Write Enable (GW) overrides all byte write inputs and writes data of CY7C1361V25, CY7C1365V25 and CY7C1363V25 to all four bytes. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Selects (CE1, CE2, CE3) of CY7C1361V25, CY7C1365V25 and CY7C1363V25 and an asynchronous output enable (OE) provide for easy bank selection and output three-state control.




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