Features: • Supports 113-MHz bus operations• 256K x 36 / 256K x 32 / 512K x 18 common I/O• Fast clock-to-output times -7.5 ns (for 117-MHz device) -8.5 ns (for 100-MHz device) -10.0 ns (for 80-MHz device)• Two-bit wrap-around counter supporting either interleaved or linear ...
CY7C1363V25: Features: • Supports 113-MHz bus operations• 256K x 36 / 256K x 32 / 512K x 18 common I/O• Fast clock-to-output times -7.5 ns (for 117-MHz device) -8.5 ns (for 100-MHz device) -10....
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The CY7C1361V25, CY7C1365V25 and CY7C1363V25 are 2.5v, 256K x 36, 256K x 32 and 512K x 18 synchronousflowthrough SRAM designed to interface with high-speed microprocessors with minimal glue logic. Maximum access of CY7C1361V25, CY7C1365V25 and CY7C1363V25 delay from the clock rise is 7.5 ns (117-MHz device). A 2-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access.
The CY7C1361V25/CY7C1365V25/CY7C1363V25 supports either the interleaved or linear burst sequences, selected by the MODE input pin. A HIGH selects an interleaved burst sequence, while a LOW selects a linear burst sequence. Burst accesses of CY7C1361V25, CY7C1365V25 and CY7C1363V25 can be initiated by asserting either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC) at clock rise. Address advancement through the burst sequence is controlled by the ADV input. Byte write operations are qualified with the Byte Write Select (BWa,b,c,d for CY7C1361V25/CY7C1365V25 and BWa,b for CY7C1363V25) inputs. A Global Write Enable (GW) overrides all byte write inputs and writes data to all four bytes. All writes are conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous output of CY7C1361V25, CY7C1365V25 and CY7C1363V25 enable (OE) provide for easy bank selection and output three-state control.