CY7C1177V18

Features: · 18 Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)· 300 MHz to 400 MHz clock for high bandwidth· 2-Word burst for reducing address bus frequency· Double Data Rate (DDR) interfaces - (data transferred at 800 MHz) @ 400 MHz· Read latency of 2.5 clock cycles· Two input clocks (K a...

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SeekIC No. : 004319836 Detail

CY7C1177V18: Features: · 18 Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)· 300 MHz to 400 MHz clock for high bandwidth· 2-Word burst for reducing address bus frequency· Double Data Rate (DDR) interfaces ...

floor Price/Ceiling Price

Part Number:
CY7C1177V18
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

· 18 Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
· 300 MHz to 400 MHz clock for high bandwidth
· 2-Word burst for reducing address bus frequency
· Double Data Rate (DDR) interfaces
    - (data transferred at 800 MHz) @ 400 MHz
· Read latency of 2.5 clock cycles
· Two input clocks (K and K) for precise DDR timing
    - SRAM uses rising edges only
· Echo clocks (CQ and CQ) simplify data capture in high-speed systems
· Data valid pin (QVLD) to indicate valid data on the output
· Synchronous internally self-timed writes
· Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD[1]
· HSTL inputs and Variable drive HSTL output buffers
· Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
· Offered in both Pb-free and non Pb-free packages
· JTAG 1149.1-compatible test access port
· Delay Lock Loop (DLL) for accurate data placement



Specifications

Storage Temperature ................................ 65°C to + 150°C
Ambient Temperature with Power Applied.. 55°C to + 125°C
Supply Voltage on VDD Relative to GND...........0.5V to + 2.9V
Supply Voltage on VDDQ Relative to GND........ 0.5V to + VDD
DC Applied to Outputs in High-Z ...........0.5V to VDDQ + 0.3V
DC Input Voltage ................................... 0.5V to VDD + 0.3V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage (MIL-STD-883, M 3015)...... >2001V
Latch up Current...................................................... >200 mA



Description

The CY7C1166V18, CY7C1177V18, CY7C1168V18, and CY7C1170V18 are 1.8V Synchronous Pipelined SRAMs equipped with DDR-II+ architecture. The DDR-II+ consists of an SRAM core with an advanced synchronous peripheral circuitry.

Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data of CY7C1177V18 is registered on the rising edges of both K and K. Read data is driven on the rising edges of K and K. Each address location is associated with two 8-bit words (CY7C1166V18), or 9-bit words (CY7C1177V18), or 18-bit words (CY7C1168V18), or 36-bit words (CY7C1170V18) that burst sequentially into or out of the device.

Asynchronous inputs of CY7C1177V18 include output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need for separately capturing data from each individual DDR SRAM in the system design.

All synchronous inputs of CY7C1177V18 pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.




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