CY74FCT373T

Features:

`Function and Pinout Compatible With FCT and F Logic
`Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
`Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
`I_off Supports Partial-Power-Down Mode Operation
`ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
`Matched Rise and Fall Times
`Fully Compatible With TTL Input and Output Logic Levels
`3-State Outputs
`CY54FCT373T
32-mA Output Sink Current
12-mA Output Source Current
`CY74FCT373T
64-mA Output Sink Current
32-mA Output Source Current


Pinout




Specifications

Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 7 V
DC output current (maximum sink current/pin)  . . . . . . . . . . . . . . . . . . . .  .120 mA
Package thermal impedance, _JA (see Note 1): Q package. . . . . . . . . . .. 68°C/W
SO package  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . .  . .  . .  . .  . .  .58°C/W
Ambient temperature range with power applied, T_A  . . . . . . . . .65°C to 135°C
Storage temperature range, T_stg  . . . . . . . . . . . . . . . . . . .  . . . .65°C to 150°C


Description

The 'FCT373T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE ) input is low. When OE is high, the bus output of FCT373T is in the high-impedance state. In this mode, data can be entered into the latches.
FCT373T is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.