CY62168EV30

Features: • Very high speed: 45 ns• Wide voltage range: 2.20V 3.60V• Ultra low standby power - Typical standby current: 1.5 µA - Maximum standby current: 12 µA• Ultra low active power - Typical active current: 2.2 mA @ f = 1 MHz• Easy memory expansion wit...

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SeekIC No. : 004319459 Detail

CY62168EV30: Features: • Very high speed: 45 ns• Wide voltage range: 2.20V 3.60V• Ultra low standby power - Typical standby current: 1.5 µA - Maximum standby current: 12 µA• ...

floor Price/Ceiling Price

Part Number:
CY62168EV30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Very high speed: 45 ns
• Wide voltage range: 2.20V 3.60V
• Ultra low standby power
   - Typical standby current: 1.5 µA
   - Maximum standby current: 12 µA
• Ultra low active power
   - Typical active current: 2.2 mA @ f = 1 MHz
• Easy memory expansion with CE1, CE2 and OE features
• Automatic power down when deselected
• CMOS for optimum speed/power
• Offered in Pb-free 48-ball FBGA package. For Pb-free 48-pin TSOP I package, refer to CY62167EV30 data sheet.



Pinout

  Connection Diagram


Specifications

Storage Temperature .................................65°C to +150°C
Ambient Temperature with
Power Applied.............................................55°C to +125°C
Supply Voltage to Ground
Potential ....................................... 0.3V to VCC(max) + 0.3V
DC Voltage Applied to Outputs
in High-Z State[4, 5] ...................... 0.3V to VCC(max) + 0.3V
DC Input Voltage[4, 5] ...................0.3V to VCC(max) + 0.3V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage...........................................> 2001V
(MIL-STD-883, Method 3015)
Latch up Current..................................................... > 200 mA



Description

The CY62168EV30 is a high performance CMOS static RAM organized as 2M words by 8 bits. This device features advanced circuit design to provide an ultra low active current. This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The CY62168EV30 also has an automatic power down feature that significantly reduces power consumption by 90% when addresses are not toggling. Placing the device into standby mode reduces power consumption by more than 99% when deselected (Chip Enable 1 (CE1) HIGH or Chip Enable 2 (CE2) LOW). The input and output pins of CY62168EV30(IO0 through IO7) are placed in a high impedance state when: the device is deselected (Chip Enable 1 (CE1) HIGH or Chip Enable 2 (CE2) LOW), outputs are disabled (OE HIGH), or a write operation is in progress (Chip Enable 1 (CE1) LOW and Chip Enable 2 (CE2) HIGH and WE LOW).

Write to the CY62168EV30 by taking Chip Enable 1 (CE1) LOW and Chip Enable 2 (CE2) HIGH and the Write Enable (WE) input LOW. Data on the eight IO pins (IO0 through IO7) is then written into the location specified on the address pins (A0 through A20).

Read from the CY62168EV30 by taking Chip Enable 1 (CE1) and Output Enable (OE) LOW and Chip Enable 2 (CE2) HIGH while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the IO pins.

The eight input and output pins of CY62168EV30 (IO0 through IO7) are placed in a high impedance state when the device is deselected (CE1 LOW and CE2 HIGH), the outputs of CY62168EV30 are disabled (OE HIGH), or a write operation is in progress (CE1 LOW and CE2 HIGH and WE LOW). See the "Truth Table" on page 8 for a complete description of read and write modes.




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