CY62158DV30

Features: • Very high speed: 45 ns, 55 ns and 70 ns - Wide voltage range: 2.20V 3.60V• Ultra-low active power - Typical active current:1.5 mA @ f = 1 MHz - Typical active current: 12 mA @ f = fmax• Ultra-low standby power• Easy memory expansion with CE1, CE2, and OE featur...

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SeekIC No. : 004319452 Detail

CY62158DV30: Features: • Very high speed: 45 ns, 55 ns and 70 ns - Wide voltage range: 2.20V 3.60V• Ultra-low active power - Typical active current:1.5 mA @ f = 1 MHz - Typical active current: 12 mA...

floor Price/Ceiling Price

Part Number:
CY62158DV30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Very high speed: 45 ns, 55 ns and 70 ns
   - Wide voltage range: 2.20V 3.60V
• Ultra-low active power
   - Typical active current:1.5 mA @ f = 1 MHz
   - Typical active current: 12 mA @ f = fmax
• Ultra-low standby power
• Easy memory expansion with CE1, CE2, and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered in a 48-ball BGA, 48-pin TSOPI, and 44-pin TSOPII



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines,not tested.)
Storage Temperature ..................................65°C to +150°C
Ambient Temperature with
Power Applied.................................................55°C to +125°C
Supply Voltage to Ground Potential ...0.3V to Vcc(max) + 0.3V
DC Voltage Applied to Outputs
in High-Z State[5, 6] ........................ 0.3V to VCC(max) + 0.3V
DC Input Voltage[5, 6] .....................0.3V to VCC(max) + 0.3V
Output Current into Outputs (LOW)................................. 20 mA
Static Discharge Voltage................................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.......................................................... >200 mA



Description

The CY62158DV30 is a high-performance CMOS static RAMs organized as 1024K words by 8 bits. This device features advanced circuit design to provide ultra-low active current.

This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The CY62158DV30 also has an automatic power-down feature that significantly reduces power consumption. The CY62158DV30 can be put into standby mode reducing power consumption by 85% when deselected (CE1 HIGH or CE2 LOW).

Writing to the CY62158DV30 is accomplished by taking Chip Enable 1 (CE1) and Write Enable (WE) inputs LOW and Chip Enable 2 (CE2) HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A19).

Reading from the CY62158DV30 is accomplished by taking Chip Enable 1 (CE1) and Output Enable (OE) LOW and Chip Enable 2 (CE2) HIGH while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins CY62158DV30 will appear on the I/O pins.

The eight input/output pins of CY62158DV30 (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE1
LOW and CE2 HIGH), the outputs of CY62158DV30 are disabled (OE HIGH), or during a write operation (CE1 LOW and CE2 HIGH and WE LOW). See the truth table for a complete description of read and write modes.




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