CY62147EV18

Features: Very high speed: 55 ns Wide voltage range: 1.65V2.25V Pin compatible with CY62147DV18 Ultra low standby power` Typical standby current: 1 µA` Maximum standby current: 7 µA Ultra low active power` Typical active current: 2 mA @ f = 1 MHz Ultra low standby power Easy memory ex...

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SeekIC No. : 004319433 Detail

CY62147EV18: Features: Very high speed: 55 ns Wide voltage range: 1.65V2.25V Pin compatible with CY62147DV18 Ultra low standby power` Typical standby current: 1 µA` Maximum standby current: 7 µA Ult...

floor Price/Ceiling Price

Part Number:
CY62147EV18
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

Very high speed: 55 ns
Wide voltage range: 1.65V2.25V
Pin compatible with CY62147DV18
Ultra low standby power
` Typical standby current: 1 µA
` Maximum standby current: 7 µA
Ultra low active power
` Typical active current: 2 mA @ f = 1 MHz
Ultra low standby power
Easy memory expansion with CE and OE features
Automatic power down when deselected
CMOS for optimum speed and power
Available in a Pb-free 48-Ball VFBGA package



Specifications

Exceeding the maximum ratings may shorten the battery life of
the device. User guidelines are not tested.
Storage Temperature ............................... 65°C to + 150°C
Ambient Temperature with
Power Applied .......................................... 55°C to + 125°C
Supply Voltage to Ground
Potential .............................0.2V to + 2.45V (VCCmax + 0.2V)
DC Voltage Applied to Outputs
in High Z State[4, 5]............... 0.2V to 2.45V (VCCmax + 0.2V)
DC Input Voltage[4, 5] ........... 0.2V to 2.45V (VCCmax + 0.2V)
Output Current into Outputs (LOW) ................................ 20 mA
Static Discharge Voltage .............................................. > 2001V
(MIL-STD-883, Method 3015)
Latch up Current ....................................................... > 200 mA



Description

The CY62147EV18 is a high performance CMOS static RAM organized as 256K words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The CY62147EV18 also has an automatic power down feature that significantly reduces power consumption of CY62147EV18 when addresses are not toggling. Placing the device into standby mode reduces power consumption by more than 99% when deselected (CE HIGH or both BLE and BHE are HIGH).

The input and output pins of CY62147EV18(IO0 through IO15) are placed in a high impedance state when:
Deselected (CE HIGH)
Outputs are disabled (OE HIGH)
Both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH)
When a write operation is active (CE LOW and WE LOW).

To write to the CY62147EV18, take Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW then data from IO pins (IO0 through IO7) is written into the location specified on the address pins (A0 through A17). If Byte High Enable (BHE) is LOW, then data of CY62147EV18 from IO pins (IO8 through IO15) is written into the location specified on the address pins (A0 through A17).

To read from the CY62147EV18, take Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on IO0 to IO7. If Byte High Enable (BHE) is LOW, then data from memory appears on IO8 to IO15. See the "Truth Table" on page 9 for a complete description of read and write modes. For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.




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