CY62146DV30

Features: • Very high speed: 45 ns• Wide voltage range: 2.20V3.60V• Pin-compatible with CY62146CV30• Ultra-low active power - Typical active current: 1.5 mA @ f = 1 MHz - Typical active current: 8 mA @ f = fmax• Ultra low standby power• Easy memory expansion wit...

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SeekIC No. : 004319425 Detail

CY62146DV30: Features: • Very high speed: 45 ns• Wide voltage range: 2.20V3.60V• Pin-compatible with CY62146CV30• Ultra-low active power - Typical active current: 1.5 mA @ f = 1 MHz - Typ...

floor Price/Ceiling Price

Part Number:
CY62146DV30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Very high speed: 45 ns
• Wide voltage range: 2.20V3.60V
• Pin-compatible with CY62146CV30
• Ultra-low active power
  - Typical active current: 1.5 mA @ f = 1 MHz
   - Typical active current: 8 mA @ f = fmax
• Ultra low standby power
• Easy memory expansion with CE, and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered 48-ball BGA and 44-pin TSOPII
• Also available in Lead-free packages



Pinout

  Connection Diagram


Specifications

Storage Temperature ...........................65°C to +150°C
Ambient Temperature with
Power Applied........................................55°C to +125°C
Supply Voltage to Ground
Potential ..................................0.3V to + VCC(MAX) + 0.3V
DC Voltage Applied to Outputs
in High-Z State[6, 7] ................... 0.3V to VCC(MAX) + 0.3V
DC Input Voltage[6, 7] ............... 0.3V to VCC(MAX) + 0.3V
Output Current into Outputs (LOW)........................... 20 mA
Static Discharge Voltage.......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... >200 mA



Description

The CY62146DV30 is a high-performance CMOS static RAM organized as 256K words by 16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ (MoBL) in portable applications such as cellular telephones. The CY62146DV30 also has an automatic power-down feature that significantly reduces power consumption.

The CY62146DV30 can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE HIGH), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a write operation (CE LOW and WE LOW). Writing to the CY62146DV30 is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A17). If Byte High Enable (BHE) is LOW, then data from I/O pins of CY62146DV30 (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A17).

Reading from the CY62146DV30 is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes. The CY62146DV30 is available in a 48-ball VFBGA, 44-pin TSOPII packages.




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