CY62127DV20

Features: • Very high speed: 55 ns• Wide voltage range: 1.65V to 2.2V• Ultra-low active power-Typical active current: 0.5 mA @ f = 1 MHz-Typical active current: 3.75 mA @ f = fMAX• Ultra-low standby power• Easy memory expansion with CE1, CE2, and OE features• Au...

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SeekIC No. : 004319382 Detail

CY62127DV20: Features: • Very high speed: 55 ns• Wide voltage range: 1.65V to 2.2V• Ultra-low active power-Typical active current: 0.5 mA @ f = 1 MHz-Typical active current: 3.75 mA @ f = fMAX&...

floor Price/Ceiling Price

Part Number:
CY62127DV20
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

• Very high speed: 55 ns
• Wide voltage range: 1.65V to 2.2V
• Ultra-low active power
-Typical active current: 0.5 mA @ f = 1 MHz
-Typical active current: 3.75 mA @ f = fMAX
• Ultra-low standby power
• Easy memory expansion with CE1, CE2, and OE  features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered in a 48-ball FBGA and a 44-pin TSOP Type II



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .................................65°C to +150°C
Ambient Temperature with
Power Applied............................................. 55°C to +125°C
Supply Voltage to Ground Potential
.........................................................−0.2V to VCCMAX + 0.2V
DC Voltage Applied to Outputs
in High-Z State[3] ....................................−0.2V to VCC + 0.2V
DC Input Voltage[3] ................................ −0.2V to VCC + 0.2V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current .................................................... > 200 mA
Operating Range



Description

The CY62127DV20 is a high-performance CMOS static RAM organized as 64K words by 16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The device also has an automatic power-down feature that significantly reduces power consumption by 99% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip Enable 1 (CE1) HIGH or Chip Enable 2 (CE2) LOW or both BHE and BLE are HIGH. The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected Chip Enable 1 (CE1) HIGH or Chip Enable 2 (CE2) LOW, outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHEBLE HIGH) or during a write operation (Chip Enable 1 (CE1) LOW and Chip Enable 2 (CE2) HIGH and WE LOW).

Writing to the CY62127DV20 is accomplished by taking Chip Enable 1 (CE1) LOW and Chip Enable 2 (CE2) HIGH and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then das pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A15).

Reading from the CY62127DV20 is accomplished by taking Chip Enable 1 (CE1) LOW and Chip Enable 2 (CE2) HIGH and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is low, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes.




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