Features: • One-input to nine-output buffer/driver• Supports two DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL• Low power consumption for mobile applications - Less than 32 mA at 66.6 MHz with unloaded outputs• 8.7-ns Input-Out...
CY2309NZ: Features: • One-input to nine-output buffer/driver• Supports two DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL• Low power consumption...
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• One-input to nine-output buffer/driver
• Supports two DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL
• Low power consumption for mobile applications
- Less than 32 mA at 66.6 MHz with unloaded outputs
• 8.7-ns Input-Output delay
• Buffers all frequencies from DC to 133.33 MHz
• Output-output skew less than 250 ps
• Multiple VDD and VSS pins for noise and electromagnetic interference (EMI) reduction
• Space-saving 16-pin 150-mil SOIC package
• 3.3V operation
• Industrial temperature available
Supply Voltage to Ground Potential ............... 0.5V to +7.0V
DC Input Voltage (Except REF) ...............0.5V to VDD + 0.5V
DC Input Voltage REF........................................... 0.5V to 7V
Storage Temperature ................................ 65°C to +150°C
Junction Temperature.................................................. 150°C
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ..........................>2,000V
The CY2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. The part has nine outputs, eight of which can be used to drive 2 DIMMs or 4 SO-DIMMs, and the remaining can be used for external feedback to a PLL. The device operates at 3.3V and outputs can run up to 133.33 MHz.
The CY2309NZ is designed for low EMI and power optimization. It has multiple VSS and VDD pins for noise optimization and consumes less than 32 mA at 66.6 MHz, making it ideal for the low-power requirements of mobile systems. It is available in an ultra-compact 150-mil 16-pin SOIC package.