CSPRC032A

• 4 EMI filter lines per device
• Filters attenuate to -30dB at 3GHz
• CSP package minimizes cross-talk
• 9-bump 2.485mm X 0.985mm Chip Scale
• Package (CSP), 0.5mm pitch
• 0.30mm Eutectic solder bumps
• Ultra small foot print suitable for portable devices
• Lead-free version available

The CSPRC032A is a 4-channel low pass EMI filter (R-C-R configuration) in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California Micro Devices&prime unique thin film technology provides a minimum of -25dB of attenuation over this frequency band.

CSPRC032A bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal

"flow through" design, allowing optimal signal routing. The solder bump CSPRC032A contacts are a 63/37 Sn/Pb alloy (Sn/Ag/Cu for lead-free finish) and are 0.30 mm in diameter.

The CSPRC032A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.